Equipment chassis rack processing analysis The heat dissipation design of the chassis cabinet is to increase the blackness of the inside and outside of the chassis, open the ventilation holes, etc., and the temperature can be lowered. The effect of the high blackness on the inner and outer surfaces of the chassis is better than that of the low blackness. The heat dissipation effect of high blackness on both sides is better than the heat dissipation on one side.

On the basis of increasing the blackness on the inner and outer surfaces of the chassis, reasonable improvement of the ventilation structure and enhanced convection of the cooling air can significantly reduce the temperature inside the device.

Ventilation holes are opened in the cabinet cabinet to take advantage of the convective heat transfer of cold air. It can be considered comprehensively according to the requirements of heat dissipation and electromagnetic compatibility. The heat in the ventilation area is standard.

The basic principle of opening the venting hole: the opening of the venting hole is conducive to the formation of an effective convection channel. The air inlet hole should be aligned with the heating element, and the air inlet hole should be far away from the hole to prevent the airflow from being short-circuited. For larger corresponding positions, the air inlet holes should be protected from dust and electromagnetic leakage.

Equipment chassis frame processing analysis of heat dissipation design principles:

1. Improve the heat transfer capability of the internal electronic components of the device like the casing;

2. Improve the heat transfer capability of the chassis to the outside world;

3. Minimize the thermal resistance on the heat transfer path to form a low thermal resistance heat flow path to ensure that the equipment works properly within the allowable temperature range.